A Nanomaterials-Based Solution Provider Solving Customer Challenges Through Creative Technology
INTREE consistently creates value across a broad spectrum of industries worldwide. Through our Japan branch, we source and supply a wide range of display-related component materials. We are dedicated to delivering innovative solutions that expand exceptional value on a global scale.
| Glass type | Non-alkali glass, Alkali glass, Quartz, heat-resisting glass | |
|---|---|---|
| Glass size | 50mm×50mm ～510mm×515mm | |
| Glass thickness | 0.05mmt～1.65mmt | |
| Via type | Through Via (True circle or Ellipse) | |
| Blind Via (True circle or Ellipse) | ||
| Via shape | Vertical shape, Hourglass shape, Inverted cone shape | |
| Via diameter | Vertical shape | Φ300μm< |
| Hourglass shape | Φ20～200μm | |
| Inverted cone shape | Φ20μm< ※ There is a thickness limitation. |
|
| Diameter accuracy | Surface diameter × 10% (3σ) | |
| Via pitch | Surface diameter + 20μm (TGV center distance) | |
| Via position accuracy | within ±15μm | |
| Aspect ratio | Maximum 10 : 1 (Glass thickness/ via diameter) ※ Processable glass type is limited |
|
| Type of plating | Conformal plating (Seed plating) | Via fill plating | |
|---|---|---|---|
| Glass type | Non-alkali glass, Alkali glass, Quartz, heat-resistant glass | ||
| Glass size | 50mmｘ50mm ～ 510mmｘ515mm | ||
| Via type | Through Via (True circle or Ellipse) | ||
| Via shape | Vertical shape, Hourglass shape, Inverted cone shape | ||
| Other | Through via | 100μm ~ 800μm | |
| Blind via | 10μm ~ 100μm | 50μm ~ 100μm | |
| Through via | Φ50μm ~ | Φ50μm ~ 100μm | |
| Blind via | Φ10μm ~ | Φ50μm ~ 100μm | |
| Other | Cross-cut test JIS5600K No peeling |
Adhesion strength Maximum 8N/cm |
|
OA-11 is used as a substrate for liquid crystal displays (LCDs) and OLED displays, as well as substrates for various thin film formation.
OA-11 has the property of very little deformation and sagging, especially due to gravity. The substrate itself is very thin, highly practical, and can withstand high-temperature processes based on excellent dimensional stability, making it a suitable glass substrate for high-quality next-generation displays based on LTPS and IGZO.
| Property | Unit | Value |
|---|---|---|
| Density | ×10³ kg/m³ | 2.52 |
| Coefficient of Thermal Expansion (30–380 °C) | ×10⁻⁷/K | 37 |
| Strain Point | °C | 685 |
| Young’s Modulus | GPa | 78 |
| Poisson’s Ratio | - | 0.2 |
| Vickers Hardness | Hv | 620 |
| Volume Resistivity (Log ρ, 350 °C) | Ω·cm | 13.0 |
| Dielectric Constant (1 MHz, RT) | - | 5.6 |
| Loss Tangent (tan δ, 1 MHz, RT) | - | 0.001 |
| Light Transmittance (λ = 550 nm) | % | 92 |
| Refractive Index (nₐ, 587.6 nm) | - | 1.53 |
| Chemical Durability – 10% HCl (80 °C, 60 min) | - | No visual change |
| Chemical Durability – 63 BHF (20 °C, 3 min) | - | No visual change |
| Alkali Oxide Content | wt% | ≤ 0.1 |
| As, Sb Content | wt% | < 0.1 |
| PRODUCT NAME | PRODUCT DESCRIPTION | FEATURES and USES |
|---|---|---|
| PANALIVE | High-strength adhesive film |
For electronic parts, electric insulation, spacers, fixing, and various labels, for shielding |
| Heat-sealing film | For adhering and insulating metals, plastics and thermoset resin |
|
| PANACREA | Anti-static film | For print-making and electronic printing |
| Primer coating film | For improving printability (sticker prints, offset prints, screen prints, etc.) |
|
| PANA-PEEL | Release liner and transcription film | Release film for resin and adhesive tape, For transfer process |
| NAME of MATERIALS | MATERIAL DESCRIPTION | FEATURES and USES |
|---|---|---|
| PET | Polyester film |
Printability, electrical insulation, heat-resistance, chemical-resistance and weatherproof Printing support materials, insulators, construction materials, packaging, labels, stamping, and surface materials for touch-key panels |
| PC | Polycarbonate film |
Printability, ease of forming, shock-resistance, cold-resistance and transparency Office automation equipment, office equipment, keyboards, glass windows, windshields, wainscot on pedestrian overpasses and optical films |
| PI | Polyimide film |
Insulation, conduction, superior heat and cold resistance Printed chips materials (PC, telecommunication devices, office automation equipment, mobile phones and camera), IC packaging, electrical panel materials (airplane equipment) |
| PPS | Polyphenylene Sulfide |
Anti-flammability, chemical-resistance, electrical attributes and heat-resistance Insulators (condensers, variable capacitors, motors and transformers), wire coating, industrial adhesive tapes and audio oscillator panels |
| PEN | Polyethylene Naphthalate |
Machine characteristics, gas-protection, weatherproof, radiation-resistance, chemical characteristics and thermal characteristics Base films magnetic recording, electrical insulator materials, electronic parts, condensers, Advanced Photo System (APS) and film bases |
| PE | Polyethylene |
Chemical-resistance, electrical insulation, cold-resistance, waterproof, weatherproof, adhesiveness and ease of forming Packaging material, food, buckets, cups, electrical wire coating, radio transmission equipment and products and general merchandises |
| PP | Polypropylene |
Chemical-resistance, heat-resistance, weatherproof and mechanical strength Chemical storage tanks, pipes, linings, device cases, dusts and straps |
| PFA/ETFE etc. | Fluorine films |
Heat-resistance, weatherproof, stain prevention and chemical resistance Chemical / heat-resistant hoses, sealants, incombustible materials and chemical / heat-resistant sheets |
| PMMA | Acrylic films |
Weatherproof, chemical-resistance, transparency, optical characteristics and ease of forming Lighting equipment, optical displays, display cases, billboards, lenses, windshields, glass and general merchandisess |
| NAME of MATERIALS | FEATURES and USES |
|---|---|
| Other optical films | UV-ray protective type, visible / infrared ray light control film, reflective film, optical diffusion film and anti-reflection film |
Hollow Silica Particles Using high-purity raw materials and a proprietary manufacturing method, we have developed a hollow silica filler designed for low-dielectric circuit boards. By adding this hollow silica filler to polymers, you can achieve low thermal expansion and low dielectric constant.
Narrow particle size distribution, uniform shell thickness of the hollow structure, and high resistance to cracking.
※ Values are not guaranteed
| Item | Unit | Measured Value |
|---|---|---|
| Average Particle Size | µm | 1 |
| Porosity | % | 50 |
| Particle Density | g/cm-³ | 1.1 |
| Relative Dielectric Constant | – | 2.0 |
Dry density method
(using nitrogen gas)
According to IEC62810 (cavity resonator perturbation method), measured at 10 GHz
Dispersing them at the nano level into resins or coatings helps improve various functional properties.
| Item | 40 nm Hollow Particles | 100 nm Hollow Particles | 200 nm Hollow Particles |
|---|---|---|---|
| Outer Diameter (nm) | 40 | 100 | 200 |
| Inner Diameter (nm) | 30 | 80 | 170 |
| Shell Thickness (nm) | 5 | 10 | 15 |
| Porosity (%) | 40 | 60 | 55 |
| Specific Surface Area (m²/g) | 250 | 140 | 70 |
| Particle Density (g/cc) | 0.9 | 0.8 | 0.8 |
