- Semiconductor
Glass Substrates We specialize in advanced semiconductor packaging technologies and have established an in-house photolithography-based production system for RDL (Re-Distribution Layer), a core process enabling high-density and high-performance packaging. RDL technology enables the redistribution of wiring between chips and substrates, allowing for high-density electrical interconnections. Leveraging precise lithography techniques, we ensure the stable formation of high-quality micro-patterned redistribution layers. Our system is optimized for high-mix low-volume (HMLV) production and guarantees the highest level of material purity and process precision required in the semiconductor and display industries. By offering customized interposer solutions tailored for product development, performance verification, and reliability evaluation, we actively contribute to the advancement of next-generation high-performance electronic packaging technologies.
